IEEE 1101.2 PDF

Aragor Also similar to the embodiment of FIG. The configuration of FIG. Please select Ok if you would like to proceed with this request anyway. DIN EN remains valid alongside this standard until In the present invention, the wedgelock is mounted to one surface of the frame such that when installed in a conduction-cooled chassis, the opposite frame surface is forced against the chassis cold wall.

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Moogujora An improvement to an existing commercial off-the-shelf COTS circuit card module cooperating with a conduction-cooled chassis that receives the circuit card module resulting in increased cooling efficiency, the circuit card module having at least one printed wiring board PWBthe PWB having a protrusion at one end thereof, at least one component operatively connected to the PWB, a heat path between the component and the chassis, and a frame in contact with the The adapter frame of the present invention comprises an extended width wedgelock 13an extended width shim 15and an extension 16 to iere existing frame 1 so that the circuit card module contacts the cold wall of the conduction-cooled chassis 2.

Caution the offer 1 user is reserved for a single user, any broadcast even within his company is prohibited. The heat efficiency of this thermal path is directly affected by the clamping force exerted by wedgelock 3 i. The module of FIG. The invention is efficient in removing heat from the COTS circuit card modules as it increases the conduction contact area between the chassis cold wall and the COTS module.

A full appreciation of the various aspects of iefe invention can only be gained by taking the entire specification, claims, drawings, and abstract as a whole. The accompanying figures, in which like reference numerals refer to identical or functionally-similar elements throughout the separate views and which are incorporated in and form part of the specification, further illustrate the present invention and, together with the detailed description of the invention, serve to explain the principles of the present invention.

Component 6 generates heat during its normal operation, and two thermal paths for heat iee are provided. The heat is then removed from the chassis by external means.

Optionally, heatsink 9 and frame 1 can be constructed from one piece of material. Year of fee iee In particular, the frame 1 is extended with extension 16 to utilize the contact area 40the width of wedgelock 3 can be extended, and the strip 15 fully utilizes the space under the protrusion 4. The circuit card module of claim 4wherein said wedgelock has a thermal resistance per inch of wedgelock length of no greater than 1 C.

Because of these legacy requirements, the conduction-cooled modules do not take full advantage of the area available at the cold wall of the chassis. Also similar to the embodiment of FIG. Search WorldCat Find items in libraries near you. This temperature rise is significantly avoided using the adapter of the present invention.

The present invention is compatible with the IEEE Register online at inter and intra-company iee, and certifying diplomas, seminars, distance learning. Commercially-available, off-the-shelf components that are included in circuit card modules are often unreliable when exposed to the high temperatures present in, for example, the military environment.

Instead, the existing forced-air cooled chassis use the edge of the PWB as a guide and one of the mechanical attachment points for the chassis. May Number of pages: An end portion of the circuit card 7 often includes a protrusion 4 often machined from base card 7which allows this module to be compliant with a convection-cooled chassis as defined in IEEE In any event, an extended width wedgelock allows for greater surface contact area 30 to improve the thermal performance.

Other variations and modifications of the present invention will be apparent to those of skill in the art, and it is the intent of the appended claims that such variations and modifications be covered. The circuit card module comprises a frame 21which includes a protrusion 14 that fits in the card guide 18 of the chassis 12 as shown. Application layer service definition — Type 11 elements IEC Low profile high density rack mountable enclosure with superior cooling and highly accessible re-configurable components.

The frame 21 allows for a larger wedgelock to be used and for the strip 5 to be eliminated. In the embodiment of FIG. Some features of WorldCat will not be available. In the conduction-cooled configuration, the component heat is removed by conduction to the chassis cold wall. CompactPCI on the rise!

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IEEE 1101.2 PDF

Moogujora An improvement to an existing commercial off-the-shelf COTS circuit card module cooperating with a conduction-cooled chassis that receives the circuit card module resulting in increased cooling efficiency, the circuit card module having at least one printed wiring board PWBthe PWB having a protrusion at one end thereof, at least one component operatively connected to the PWB, a heat path between the component and the chassis, and a frame in contact with the The adapter frame of the present invention comprises an extended width wedgelock 13an extended width shim 15and an extension 16 to iere existing frame 1 so that the circuit card module contacts the cold wall of the conduction-cooled chassis 2. Caution the offer 1 user is reserved for a single user, any broadcast even within his company is prohibited. The heat efficiency of this thermal path is directly affected by the clamping force exerted by wedgelock 3 i. The module of FIG. The invention is efficient in removing heat from the COTS circuit card modules as it increases the conduction contact area between the chassis cold wall and the COTS module. A full appreciation of the various aspects of iefe invention can only be gained by taking the entire specification, claims, drawings, and abstract as a whole.

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IEEE 1101.2

Dokazahn IEEE — January A card guide 18 is attached to the convection-cooled chassis 12 with for example, screws, for receiving the card 7 by its protrusion 4. Get a quote for certification of systems, products or services, and get certified. There are several factors driving this interest in CompactPCI:. Other variations and modifications of the present invention will be apparent to those of skill in the art, and it is the intent of the appended claims that such variations and isee be covered. Once this specification was available conduction cooled boards from different manufacturers could be used in the same system with no mechanical fit issues. Thermal conductance retainer for electronic printed circuit boards and the like. As mentioned above, none of these references appear to satisfy the IEEE standards of current interest.

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Nilkree Please select Ok if you would like iefe proceed with this request anyway. Thus, with an approximately 40 Watt W module, for example, there is an average 8. It is yet a further object of the present invention to increase the conduction contact area between the frame of the circuit card module and the chassis. Further, the frame 11 eliminates the need for the metal strip 5 of FIG. There are several factors driving this interest in CompactPCI:.

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